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发明公开
CN103985667A 电性连接结构及其制备方法 有权

电性连接结构及其制备方法
摘要：
本发明是有关于一种用以电性连接一第一基板及一第二基板的电性连接结构及其制备方法，其中制备方法包括：(A)提供一第一基板及一第二基板，其中第一基板上设有一第一铜膜，第二基板上设有一第一金属膜，第一铜膜的一第一接合面为一含(111)面的接合面，且该第一金属膜具有一第二接合面；以及(B)将第一铜膜及第一金属膜相互接合以形成接点，其中第一铜膜的第一接合面与第一金属膜的第二接合面相互对应。
摘要（英）：

An electrical connecting element for connecting a first substrate and a second substrate and a method for manufacturing the same are disclosed. The method of the present invention comprises: (A) providing a first substrate and a second substrate, wherein a first copper film is formed on the first substrate, a first metal film is formed on the second substrate, a first connecting surface of the first copper film has a (111)-containing surface, and the first metal film has a second connecting surface; and (B) connecting the first copper film and the first metal film to form an interconnect, wherein the first connecting surface of the first copper film is faced to the second connecting surface of the first metal film.

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