A surfacing film is formed from a curable resin composition. The resin composition comprises an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, an amine-based curing agent, particulate inorganic fillers and a toughening component. The surfacing film exhibits high Tg and high cross-linked density after curing, as well as high resistance to paint stripper solutions. The surfacing film is suitable for co-curing with fiber-reinforced resin composite materials. The surfacing film may optionally contain electrically conductive additives to provide sufficient conductivity for lightning strike protection (LSP) or electromagnetic interference (EMI) shielding.