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CN104006914A 用于具有两层芯片结构的压力传感器的系统和方法 无效 - 撤回

用于具有两层芯片结构的压力传感器的系统和方法
摘要：
提供用于具有两层芯片结构的压力传感器的系统和方法，其中，压力传感器包括：壳体，该壳体具有高侧输入端口和低侧输入端口，当把壳体置于含有高压和低压介质的环境中时，高侧输入端口允许高压介质进入壳体的高侧并且低侧输入端口允许低压介质进入壳体的低侧；安装在壳体内的基底；安装到基底的应力隔离构件；具有感测电路的芯片堆，该芯片堆结合到应力隔离构件；涂覆到基底、应力隔离构件和芯片堆的暴露于低侧输入端口的表面的低侧原子层沉积物（ALD）；以及涂覆到应力隔离构件和芯片堆的暴露于高侧输入端口的表面的高侧原子层沉积物（ALD）。
摘要（英）：

Systems and methods for a pressure sensor are provided, where the pressure sensor comprises a housing having a high side input port that allows a high pressure media to enter a high side of the housing and a low side input port that allows a low pressure media to enter a low side of the housing when the housing is placed in an environment containing the high and low pressure media; a substrate mounted within the housing; a stress isolation member mounted to the substrate; a die stack having sensing circuitry bonded to the stress isolation member; a low side atomic layer deposition (ALD) applied to surfaces, of the substrate, the stress isolation member, and the die stack, exposed to the low side input port; and a high side ALD applied to surfaces, of the stress isolation member and the die stack, exposed to the high side input port.

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