A molding packaging material 1 of this invention contains a biaxially stretched polyamide film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, and a metal foil layer 4 disposed between the both layers 2 and 3, in which a biaxially stretched polyamide film in which when the fracture strength of the film is defined as “X” and the fracture strain of the film is defined as “Y”, the X/Y value is 230 MPa to 360 MPa is used as the biaxially stretched polyamide film 2. The molding packaging material can secure excellent moldability even when the molding packaging material is not coated with a slipperiness imparting component.