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发明授权
CN104051675B 显示器件及其邦定方法 有权 转让

显示器件及其邦定方法
摘要：
本发明揭示了一种显示器件的邦定方法及由上述邦定方法制成的显示器件。所述显示器件包括基板及设于基板上的邦定件，基板上设有与邦定件对应的邦定区。所述显示器件的邦定方法包括：于基板邦定区覆盖各向异性导电膜；原子层沉积并形成原子层沉积层；对覆盖各向异性导电膜的位置进行穿刺；及将邦定件邦定至各向异性导电膜。上述显示器件邦定方法，使用原子层沉积技术对基板进行封装，并将邦定件的邦定工艺过程设定在各向异性导电膜沉积之后，通过对覆盖各向异性导电膜的位置进行穿刺进而实现基板与邦定件之间的邦定。这种邦定方法无需对原子层沉积层进行图形化处理，就可以实现显示器件的有效邦定，简化了显示器件的邦定工艺并降低了生产成本。
摘要（英）：

The invention discloses a binding method of a display device and the display device manufactured according to the binding method. The display device comprises a substrate and a binding piece arranged on the substrate. A binding area corresponding to the binding piece is arranged on the substrate. The binding method of the display device includes the steps of covering the binding area of the substrate with a piece of anisotropic conducting film, conducting atomic layer deposition to form an atomic layer deposition layer, puncturing the position covered with the anisotropic conducting film, and binding the binding piece to the anisotropic conducting film. According to the binding method of the display device, the substrate is packaged according to the atomic layer deposition technology, the binding process of the binding piece is set behind deposition of the anisotropic conducting film, and the substrate and the binding piece are bound by puncturing the position covered with the anisotropic conducting film. By means of the binding method, the display device can be effectively bound without conducting graphical processing on the atomic layer deposition layer, the binding process of the display device is simplified, and production cost is reduced.

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