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发明授权
CN104091860B LED封装光源及其生产工艺 失效 - 权利终止 转让

LED封装光源及其生产工艺
摘要：
本发明公开了一种LED封装光源，包括基板、胶板、封装玻璃、及设置于所述基板的LED芯片，所述封装玻璃设置于所述基板设置有所述LED芯片的一侧；所述胶板为透明材质，所述胶板夹设于所述基板和所述封装玻璃之间，且所述胶板的两侧分别粘结于所述基板和所述封装玻璃。与现有技术相比，本发明提供的LED封装光源，透明材质的胶板置于基板和封装玻璃之间，胶板两侧分别粘结基板和封装玻璃，胶板与基板、胶板和封装玻璃的粘结面积均比较大，使得基板、胶板和封装玻璃三者之间的粘结稳定性比较好，以提高LED封装光源的稳定性。本发明还公开了一种LED封装光源的生产工艺。
摘要（英）：

The invention discloses an LED packaging light source comprising a substrate, a rubber plate, packaging glass and an LED chip arranged on the substrate, the packaging glass is arranged on one side, provided with the LED chip, of the substrate, the rubber plate is made of transparent materials, the rubber plate is clamped between the substrate and the packaging glass, and the two sides of the rubber plate are bonded on the substrate and the packaging glass. Compared with the prior art, the rubber plate made of the transparent materials is arranged between the substrate and the packaging glass, the two sides of the rubber plate are bonded on the substrate and the packaging glass respectively, the bonding area of the rubber plate and the substrate and the bonding area of the rubber plate and the packaging glass are large, the bonding stability among the substrate, the rubber plate and the packaging glass is good, and the stability of the LED packaging light source is improved. The invention further discloses a manufacturing process of the LED packaging light source.

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