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发明公开
CN104218013A 半导体装置以及半导体装置的制造方法 有权

半导体装置以及半导体装置的制造方法
摘要：
本发明涉及半导体装置以及半导体装置的制造方法，其提高半导体装置的可靠性。半导体装置(1)具有搭载了半导体芯片(3)的管芯焊盘(10)。管芯焊盘(10)以使位于搭载了半导体芯片(3)的上表面(10a)的相反侧的下表面(10b)露出的方式被树脂密封。另外，管芯焊盘(10)在俯视时，具有包括搭载了半导体芯片(3)的区域的中央部(11)、和设置在中央部(11)的旁边的边缘部(12)。另外，在中央部(11)和边缘部(12)的边界，设置了以使边缘部(12)的高度高于中央部(11)的高度的方式来形成的阶梯面(13a)。
摘要（英）：

The invention relates to a semiconductor device and a manufacturing method of the semiconductor device. A technique capable of enhancing a reliability of a semiconductor device is provided. The semiconductor device (1) has a die pad (10) on which a semiconductor chip (3) is mounted. The die pad (10) is sealed with resin so that a lower surface (10b) located on an opposite side of an upper surface (10b) on which the semiconductor chip (3) is mounted is exposed. Also, the die pad (10) has a central part (11) including a region in which the semiconductor chip (3) is mounted and a peripheral edge part (12) provided next to the central part (11) in a planar view. In addition, a step surface (13a) formed so that a height of the peripheral edge part becomes higher than a height of the central part (11) is provided at a boundary between the central part (11) and the peripheral edge part (12).

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