The present invention relates to a continuous plating apparatus, and more particularly, to a continuous plating apparatus comprising: a frame; a driving roller on which an object to be plated, having a predetermined width and extending in one direction, is wound, wherein the driving roller rotates by means of power transmitted by rotating means, and the driving roller is installed in the frame; a slave roller installed in the frame and spaced apart from the driving roller such that the object to be plated gets caught at the slave roller; a cathode roller installed in the frame and disposed on the path between the driving roller and the slave roller, along which the object to be plated moves, wherein the cathode roller contacts the object to be plated so as to charge the object to be plated with electricity of a cathode; and an anode nozzle unit installed in the frame, which sprays a plating solution including a cation on the contact area between the cathode roller and the object to the plated.