The invention belongs to the field of adhesives and discloses an epoxy resin adhesive used for a wood floor and a preparation method of the epoxy resin adhesive. The epoxy resin adhesive used comprises the following components: 29 to 35 parts of bisphenol-F epoxy resin, 11 to 17 parts of bisphenol-S epoxy resin, 3 to 6 parts of 3,4-epoxy cyclohexyl methyl 3,4-epoxy cyclohexyl formic ether, 9 to 15 parts of polymide resin, 6 to 11 parts of polyvinyl acetate, 5 to 8 parts of p-hydroxybenzenesulfonic acid and 3 to 6 parts of propyl acetate. The preparation method comprises the following steps: opening a reaction tank, placing the components in the reaction tank according to weight, heating the reaction tank for temperature rise, stirring, placing the mixture in the reaction tank into a container and sealing the container, so as to obtain the epoxy resin adhesive used for wood floor.