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发明授权
CN104377157B 封装母板的真空吸附系统及吸附方法、封装装置 有权

封装母板的真空吸附系统及吸附方法、封装装置
摘要：
本发明提供一种封装母板的真空吸附系统及其吸附方法、封装装置，属于基板封装技术领域，本发明的封装母板的真空吸附系统，包括真空吸附平台，以及承载平台，设于所述真空吸附平台上并与所述吸附平台边缘密封，所述承载平台用于承载封装母板，且其上设置有多个吸附单元；检测单元，用于检测调整平台上的吸附单元与封装母板上的封装区域的位置关系；以及，调整单元，用于当检测单元检测到所述吸附单元所在位置与封装母板上的封装区域重合时，调整承载平台位置，使得至少部分吸附单元与封装母板上的封装区域无重合。
摘要（英）：

The present invention provides a vacuum adsorption system and an adsorption method thereof, and a packaging device for a mother substrate to be packaged, and belongs to the field of substrate packaging technology. The vacuum adsorption system used for the mother substrate to be packaged according to the present invention includes: a vacuum adsorption platform; a carrying platform, which is provided on the vacuum adsorption platform and edges thereof are sealed with edges of the vacuum adsorption platform, configured to carrying the mother substrate to be packaged and provided thereon with a plurality of adsorption units, the adsorption units being used for adsorbing, in cooperation with the vacuum adsorption platform, the mother substrate to be packaged so as to fix the mother substrate to be packaged; a detection unit, configured to detect positional relationships between the adsorption units on the carrying platform and packaging areas on the mother substrate to be packaged; and an adjustment unit, configured to adjust the position of the carrying platform when the detection unit detects that the positions of the adsorption units on the carrying platform are overlapped with the packaging areas on the mother substrate to be packaged, so that positions of at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas on the mother substrate to be packaged.

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