The invention discloses a photosensitive resin composition, a dry film image of which is formed by exposure and development, has good side morphology and a higher resolution ratio. The resin capable of performing photopolymerization as a main component has the following structural general formula: (A)u(B)v(C)w(D)x(E)y(F)z, wherein A is methacrylic acid, B is acrylic acid, C is methyl methacrylate, D is dodecyl acrylate, E is (methyl) acrylate with a carbon chain number of 3-8, and F is phenoxyl ethyl acrylate. The photosensitive resin composition provided by the invention can be used as an etching resist material for the fields of printed circuit boards, lead frames, semiconductor encapsulation, precision machining of metal, and has the characteristics of good photosensitivity, high resolution ratio and good side morphology.