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发明授权
CN104425429B 具有多层裸片组块的半导体封装 失效 - 权利终止

具有多层裸片组块的半导体封装
摘要：
一种包括组块的半导体封装，具有第一侧，与第一侧相对的第二侧，以及从第二侧朝向第一侧延伸的凹陷区域，使得组块在凹陷区域中具有较薄部分并且在凹陷区域之外具有较厚部分。半导体封装进一步包括每一个具有相对的第一和第二侧的第一半导体裸片和第二半导体裸片。第一半导体裸片布置在组块的凹陷区域中并且在第一半导体裸片的第一侧处附接至组块的较薄部分。第二半导体裸片在第二半导体裸片的第一侧处附接至第一半导体裸片的第二侧。
摘要（英）：

A semiconductor package includes a block having a first side, a second side opposite the first side and a recessed region extending from the second side toward the first side so that the block has a thinner part in the recessed region and a thicker part outside the recessed region. The semiconductor package further includes a first semiconductor die and a second semiconductor die each having opposing first and second sides. The first semiconductor die is disposed in the recessed region of the block and attached to the thinner part of the block at the first side of the first semiconductor die. The second semiconductor die is attached to the second side of the first semiconductor die at a first side of the second semiconductor die.

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