The invention discloses a method for manufacturing a printed apparatus, a printed cover plate and a printed circuit board. The method applied to the printed circuit board comprises the following steps: coating a protective layer with a first thickness value on the printed circuit board and manufacturing a shape pattern of the printed apparatus on the protective layer; covering the protective layer with the printed cover plate, wherein the printed cover plate has a run-through region corresponding to the shape pattern and the printed cover plate has a second thickness value; injecting a viscous medium into the run-through region, wherein the top of the viscous medium in the run-through region is flush with the surface of the printed cover plate; curing the viscous medium, wherein the thickness value of the printed apparatus is the sum of the first and second thickness values.