利索-全球专利检索

  1. 登录
  2. 注册
发明授权
CN104662399B 具备内腔的设备部件以及具备内腔的设备部件的制造方法 有权

具备内腔的设备部件以及具备内腔的设备部件的制造方法
摘要：
本发明提供没有密封层侵入内腔内并填埋内腔的可能且能够以简单的工序形成具有作为预期目标的规定形状的内腔，并且作为设备具有期待功能的设备部件以及其制造方法。该设备部件具备：由半导体构成的基板部件(12)；形成于基板部件(12)的上表面且具有绝缘性的中间层(14)；形成于中间层(14)的上表面且由半导体构成的上面层(16)；形成于上面层(16)的开口部(18)；以及以密封开口部(18)的方式形成的透气性的密封层(20)，内腔(22)是由透过密封层(20)的蚀刻气体来除去中间层(14)而形成的内腔(22)。
摘要（英）：

A device member including a cavity, includes a base member, an interlayer, an upper layer, an opening portion, and a gas-permeable sealing layer. The base member includes a first semiconductor. The interlayer is formed on the base member and is non-conductive. The upper layer is formed on the interlayer and includes a second semiconductor. The opening portion is formed at the upper layer. The gas-permeable sealing layer is formed to seal the opening portion formed at the upper layer. The cavity is formed by removing the interlayer with an etching gas that penetrates through the sealing layer.

公开/授权文献
0/0