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发明授权
CN104701282B 芯片、芯片封装和管芯 有权

芯片、芯片封装和管芯
摘要：
本发明涉及芯片、芯片封装和管芯。在各种实施例中，提供用于芯片封装的芯片。芯片包含衬底和在衬底之上的集成电路。集成电路可以包含测试电路（比如内置自测试电路）和操作电路，测试电路包含每个具有第一驱动器性能的一个或多个第一驱动器级并且操作电路包含每个具有与第一驱动器性能不同的第二驱动器性能的一个或多个第二驱动器级；第一接触，与第一驱动器级电耦合；以及第二接触，与第二驱动器级电耦合，其中测试电路和第一接触被配置成提供用于测试集成电路的测试模式并且其中操作电路和第二接触被配置成提供与测试模式不同的集成电路的操作模式。
摘要（英）：

In various embodiments, a chip for a chip package is provided. The chip may include a substrate and an integrated circuit over the substrate. The integrated circuit may include a test circuit, for example a built-in self-test circuit, and an operation circuit, the test circuit including one or more first driver stages each having a first driver performance and the operation circuit including one or more second driver stages each having a second driver performance which is different from the first driver performance, first contacts electrically coupled with the first driver stages, and second contacts electrically coupled with the second driver stages, wherein the test circuit and the first contacts are configured to provide a test mode for testing the integrated circuit and wherein the operation circuit and the second contacts are configured to provide an operating mode of the integrated circuit being different from the test mode.

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