A polyamide hot melt adhesive composition is described comprising the polyamide condensation product of substantially equimolar quantities of: (a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids, and (b) an amine component consisting essentially of one or more cyclic aliphatic diamines, one or more non-cyclic aliphatic diamines in which the amine groups are bonded to odd-numbered carbon atoms on the aliphatic chain, and one or more alkylene diamines, and (c) an anti-foaming or defoaming agent comprised of a water based silicone compound comprising 5% solids in water wherein the defoaming agent reduces or eliminates foaming occurring during the condensation reaction providing the condensation product and (d) an acid based catalyst.