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CN104744892A 树脂组合物及其应用 无效 - 驳回

树脂组合物及其应用
摘要：
一种树脂组合物，包含一热固性树脂成份及一填料，其中，该热固性树脂成份在1吉赫兹（GHz）时的散逸因子（Df）≤0.006，且该填料通过1300°C至低于1400°C的高温烧结所制得的陶瓷粉体，且每100重量份该热固性树脂成份中该填料的含量为10重量份至600重量份。
摘要（英）：

A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300 DEG C. to less than 1400 DEG C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.

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