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发明授权
CN104836619B 一种光器件 有权

一种光器件
摘要：
本发明的实施例提供一种光器件，涉及光通信领域，能够满足高频信号传输的阻抗匹配要求。该光器件，包括：第一基板、第二基板和转接板；第一基板的上表面设置有第一导电通路，第一基板的下表面设置有第二导电通路；第二基板的上表面设置有第三导电通路；转接板上设置有微带线结构，微带线结构包括设置在转接板上表面的转接线路；第二基板的上表面与第一基板的下表面相对，其中第二导电通路与第三导电通路贴合，转接板设置于第二基板上表面的上方，并位于第三导电通路之间；转接线路的一端通过打线与第一导电通路电连接，转接线路的另一端通过打线与光器件的内部元件连接。本发明的实施例用于光器件制造。
摘要（英）：

An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

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