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发明授权
CN104867839B 半导体装置的制造方法和半导体装置 有权

半导体装置的制造方法和半导体装置
摘要：
本发明提供半导体装置的制造方法和半导体装置，其降低初始的泄漏电流的增加并提高了可靠性。进行树脂密封来制造半导体装置的半导体装置的制造方法的特征在于，该制造方法具备如下步骤：准备支撑板；将功率元件和控制元件载置于支撑板的主面上；以及将支撑板配置在树脂密封模具内，向模具内注入树脂而形成覆盖功率元件和控制元件的树脂密封体，在形成树脂密封体的步骤中，将多个半导体元件并列配置在支撑板上，在半导体元件数量少的列的一侧配置浇口。
摘要（英）：

The invention provides a manufacturing method of a semiconductor device and the semiconductor device. By adopting the semiconductor device, the increase of an initial leakage current is reduced, and the reliability is improved. The manufacturing method, in which the semiconductor is manufactured by means of resin sealing, of the semiconductor device is characterized in that the manufacturing method comprises the steps of preparing a supporting plate; placing a power element and a control element to a main surface of the supporting plate; and arranging the supporting plate in a resin sealing die, injecting resin into the die to form a resin sealing body covering the power element and the control element, wherein in the step of forming the resin sealing body, a plurality of semiconductor elements are arranged on the support plate in parallel, and a pouring port is disposed at one side of the row low in semiconductor element number.

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