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发明公开
CN104900562A 半导体制造装置及半导体制造方法 有权 转让

半导体制造装置及半导体制造方法
摘要：
本发明涉及半导体制造装置及半导体制造方法。根据实施方式，半导体制造装置具有第1载物台、第2载物台、移送单元及检测器。第1载物台对半导体芯片的位置进行修正。第2载物台对安装半导体芯片的对象物进行支持。移送单元将从第1载物台提举的半导体芯片向第2载物台进行移送。检测器对来自半导体芯片的弹性波进行检测。检测器安装于第1载物台及第2载物台的至少一方。
摘要（英）：

According to one embodiment, a semiconductor manufacturing device includes a first stage, a second stage, a transfer unit, and a detector. The first stage corrects a position of the semiconductor chip. The second stage supports an object into which the semiconductor chip is to be installed. The transfer unit transfers the semiconductor chip picked up from the first stage to the second stage. The detector detects an elastic wave from the semiconductor chip. The detector is attached to at least one of the first stage and the second stage.

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