The present invention provides a thermal pad and an electronic device. The thermal pad is configured to perform heat dissipation for a heat emitting component, and includes a first heat conducting layer and a second heat conducting layer. A first surface of the second heat conducting layer is in contact with a surface of the heat emitting component, and a second surface of the second heat conducting layer is in contact with a first surface of the first heat conducting layer. The first heat conducting layer is a heat conducting layer that can be compressed to deform, and a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is higher than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer. The second heat conducting layer is a heat conducting layer that cannot be compressed to deform, a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is higher than or equal to a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer, and the heat conduction capability of the second heat conducting layer in the plane direction is higher than or equal to the heat conduction capability of the first heat conducting layer in the thickness direction. In this way, the thermal pad has a very high heat conduction capability in a plane direction, and can evenly dissipate heat of the heat emitting component, thereby effectively relieving a heat dissipation difficulty caused by a problem of a partial hotspot of the heat emitting component.