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发明公开
CN105047572A 引线接合装置以及引线接合方法 有权

引线接合装置以及引线接合方法
摘要：
提供一种能够将直径500μm以上且600μm以下的引线接合到半导体元件上的电极的引线接合装置以及引线接合方法。在本发明的引线接合装置、即通过引线接合来对电极与铝合金制的引线进行电连接的引线接合装置(100)中，具备：引线提供装置(10)，其用于提供直径500μm以上且600μm以下的引线(6)；加热装置(11)，其用于将引线(6)加热到50℃以上且100℃以下；加压装置(12)，其用于在电极(2、7)处对引线(6)进行加压；以及超声波产生装置(13)，其用于对由加压装置(12)加压后的引线(6)施加超声波振动。
摘要（英）：

The invention provides a lead bonding device and a lead bonding method for bonding a lead with the diamter which is greater than 500Mum and less than 600Mum to the electrode on a semiconductor element. The lead bonding device (100) is used for electrical connection for the electrode and the lead which is made of aluminium alloy, and comprises a lead supply device (10), a heating device (11), a pressure device (12) and an ultrasonic wave generation device (13), wherein the lead supply device (10) is used for providing a lead (6) with the diameter being greater than 500Mum and less than 600Mum; the heating device (11) is used for heating the lead (6) to 50DEG C to 100DEG C; the heating device (11) is arranged at the electrodes (2, 7) for pressurization of the lead (6); and the ultrasonic wave generation device (13) is used for applying ultrasonic wave vibration to the pressurized lead (6) through the pressure device (12).

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