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Invention Grant
CN105082582B 粘结材料的方法和设备 有权

粘结材料的方法和设备
Abstract:
本发明提供粘结材料的方法和设备。一种粘结材料的方法可以包括：在对象的表面上的固化区域中在两个材料之间限定粘结界面；以及在不直接加热所述固化区域之外的表面的情况下对所述粘结界面进行非传导加热。非传导加热粘结界面可以涉及向所述粘结界面施加微波辐射。
Abstract(English):

A method of bonding materials (100) may comprise defining a bond interface (140) between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation (216) to the bond interface.

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