A crimping type electric power semiconductor module test tooling is characterized in that the compressor arm installing holes are processed on a rectangular pedestal (08), and the compressor arms (12-15) penetrate the compressor arm installing holes to be fixed on the pedestal (08); the positioning pin installing holes are also processed on the pedestal (08), and the positioning pins (09-11) penetrate the positioning pin installing holes to be fixed on the pedestal (08); a negative electrode slice (07) is positioned by the positioning pins (09-11) and is placed on the pedestal (08), a second test member (06), a public electrode slice (05), a first test member (04), a positive electrode slice (03) and a top briquetting (02) are placed on the negative electrode slice (07) orderly; a top cover plate (01) is equipped with the compressor arm installing holes and penetrates the compressor arms (12-15) to be contacted with the top briquetting (02), and a positive electrode leading-out slice (16), a public electrode leading-out slice (17) and a negative electrode leading-out slice (18) are connected with the positive electrode slice (03), the public electrode slice (05) and the negative electrode slice (07) respectively.