The invention provides a double-side heat dissipation semiconductor POP (Package on Package) packaging structure. The structure comprises a first packaging body formed by pins of a first metal frame, a first chip, a first bonding wire, first metal pieces and pins of a second metal frame and a second packaging body formed by a second chip, a second bonding wire and second metal pieces, and is characterized in that the upper part of each first metal piece is provided with flux so as to be connected with the second chip; the first chip forms circuit connection through a first pin of the first frame and the first metal pieces, and the second chip forms circuit connection through a first pin of the second frame, the second metal pieces and other pins of the first frame. The double-side heat dissipation semiconductor POP packaging structure provided by the invention is more practical. The product size is reduced, the production cost is reduced, the production process is simplified, the yield of products is improved, and the product reliability is ensured. The double-side heat dissipation semiconductor POP packaging structure meets performance requirements of products with high power, high energy consumption and high heat dissipation while improving the product packaging yield, reducing the production cost and reducing the product size.