A film thickness regulator and its manufacturing method, a regulating method, an evaporation apparatus are disclosed. The film thickness regulator comprises a frame and at least two deformable thin films disposed therein, the film surfaces of which are parallel to each other; each deformable thin film is provided with conductive structures and via holes for molecules of an evaporation coating material to pass through; when voltages are applied to the conductive structures of any two deformable thin films, due to the attraction or repulsion between the conductive structures, the two deformable thin films are moved, and the relative positions of the via holes of any two deformable thin films change, thus solving the problem that the uniformity of the thickness of the evaporation coating film is poor in the related art, and achieving the effect of improving the uniformity of the thickness of the evaporation coating film.