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发明授权
CN105185554B 磁芯三维(3D)电感器及封装集成 有权 转让

磁芯三维(3D)电感器及封装集成
摘要：
本发明涉及一种磁芯三维(3D)电感器及其封装集成，所述磁芯三维(3D)电感器包括基板、形成在基板上的第一磁壳、以及被埋置在形成在第一磁壳上的第一绝缘体层中的第一组导电迹线。磁芯板形成在第一绝缘体层上，并且第二组导电迹线被埋置在形成在磁芯板上的第二绝缘体层中。第二磁壳形成在第二绝缘体层上，并且第一组导电迹线与第二组导电迹线通过使用导电过孔导电地耦合。
摘要（英）：

A 3-dimensinal (3-D) magnetic core device includes a substrate, a first magnetic shell formed on the substrate, and a first group of conductive traces embedded in a first insulator layer formed on the first magnetic shell. A magnetic core plane is formed on the first insulator layer, and a second group of conductive traces are embedded in a second insulator layer formed on the magnetic core plane. A second magnetic shell is formed on the second insulator layer, and the first and second group of conductive traces are conductively coupled by using conductive vias.

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