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发明授权
CN105199318B 一种树脂基导热覆铜板的制备方法 有权

一种树脂基导热覆铜板的制备方法
摘要：
本发明涉及一种树脂基导热覆铜板的制备方法，所述制备方法包括胶液的配制、树脂涂布、叠陪和压制，其中所述胶液的配制所用的原料为：异氰酸酯型环氧树脂、邻甲基酚醛型环氧树脂、2‑乙基‑4‑甲基咪唑、双氰胺、金刚石粉、金红石粉、氢氧化锂、甲苯磷酸二苯酯、蒙脱土、蛭石、三氧化二锑、烯基丁二酸铜、二苯甲酮、二氧化硅、二甲基二氯硅烷和溶剂。本发明提供的一种树脂基导热覆铜板的制备方法，该方法所制备的覆铜板具有良好的导热性和耐热冲击性能。
摘要（英）：

The invention relates to a preparation method of a resin-based heat conduction copper-clad plate. The preparation method includes the steps of adhesive liquid preparing, resin coating, overlying and pressing. Raw materials used in adhesive liquid preparing comprise isocyanate epoxy resin, o-cresol-formaldehyde epoxy resin, 2-ethyl-4-methylimidazole, dicyandiamide, diamond powder, rutile powder, lithium hydroxide, cresyl diphenyl phosphate, montmorillonite, vermiculite, antimonous oxide, alkenyl succinic acid copper, benzophenone, silica, dimethyldichlorosilance and solvent. By means of the preparation method for the resin-based heat conduction copper-clad plate, the prepared copper-clad plate has good thermal conductance and thermal shock resistance.

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