The invention relates to a method for manufacturing a flexible circuit (3) for a chip card module (100). Said method comprises a step of producing electrically conductive contact pads (15) in a first sheet (11) of conductive material. A layer (8) of electrically insulating adhesive material is also used, either to adhere a second sheet (12) of electrically conductive material onto the first sheet of conductive material or to form an intermediate complex making it possible to perforate the layer of adhesive material before it is transferred onto the first sheet of conductive material. Regardless of which option is chosen, the method according to the invention makes it possible to avoid using a flexible substrate of plastic material (PET, PEN, polyimide) or composite material (glass/epoxy) to perform the structuring and metalization of the conductor tracks and contact pads used in the chip card modules. The adhesive material can be specially formulated to have intrinsic hot-melt properties compatible with an operation for inserting the electronic module into the recess of the chip card body without using an additional hot-melt adhesive. The invention also relates to a flexible circuit for a chip card manufactured using said method and to a chip card module comprising such a flexible circuit.