The invention relates to a water sprayer for a silicon wafer cutting machine. By the adoption of the water sprayer for the silicon wafer cutting machine, the defect that in the prior art, a water spraying pipe in a water spraying device for the silicon wafer cutting machine cannot be matched with a flow guiding frame conveniently is overcome. According to the water sprayer for the silicon wafer cutting machine, a water spraying pipe is fixed to a supporting plate, a filter body is arranged in the water spraying pipe, a filter cover is also arranged on the water spraying pipe, water entering a cutting field through the flow guiding frame is filtered twice, and thus the water quality is optimized; in addition, a cover body is arranged on a supporting plate, the water spraying pipe is surrounded through the cooperation of the cover body and the flow guiding frame, and both the flow guiding frame and the cover body have the guiding effect during water spraying of the water spraying pipe, so that water flow sprayed out of a water spraying tank is guided to the cutting field; due to the existence of the cover body, the water spraying direction of the water spraying tank both can face the flow guiding frame and can face the cover body; in this way, the water spraying direction of the water spraying tank does not need to be considered when the water spraying pipe and the supporting plate are assembled, and the operation of assembling the water spraying pipe and the supporting plate is convenient.