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发明授权
CN105244324B 电子封装用陶瓷绝缘子及其制作方法 有权

电子封装用陶瓷绝缘子及其制作方法
摘要：
本发明公开了一种电子封装用陶瓷绝缘子及其制作方法。涉及用于电子器件的封装外壳技术领域。所述方法不采用化学镀和键丝连接电路的情况下，通过陶瓷绝缘子内置电镀线路设计，采用电镀法完成瓷件镍金保护层镀覆，即保证镀覆层质量又能保证外观完整的需求。通过上述方法制备的陶瓷绝缘子所有线路都可与外部电路导通，从而可采用电镀法完成镍金层的镀覆，在完成所有金属镀覆后，将瓷件端面的金属化打磨掉，这样既实现了陶瓷绝缘子电路的外观完整，又保证了其结构和电性能的可靠性，提高了器件的整体性能。
摘要（英）：

The present invention discloses a ceramic insulator for electronic packaging and a method for fabricating the same, and relates to a technical field of outer shell packaging of electronic devices. Under the circumstance of using neither a chemical coating nor any bonding wire connection circuit, through a design that builds a electroplated circuit into the ceramic insulator, the method accomplishes coating of a nickel alloy protection layer onto a porcelain by an electroplating method, so that not only quality of a coating layer but also requirement of a complete appearance can be ensured. All circuits of the ceramic insulator fabricated by the aforesaid method can conduct with external circuits, such that the electroplating method can be used to accomplish coating of the nickel alloy layer, after accomplishment of all metal coating, metallization parts on an end surface of the porcelain is removed.

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