The purpose of the invention is to provide a wafer manufacturing method and a wafer manufacturing device capable of manufacturing a wafer with high quality by reducing influence of flexure of sawing wires. The wafer manufacturing method is characterized in that a plurality of concave pits are formed through laser in an ingot, the ingot is cut off through a sawing wire along the plurality of concave pits to achieve wafer formation. In addition, the wafer manufacturing device is characterized by executing the following steps, according to the wafer manufacturing method, a plurality of concave pits are formed through laser in an ingot, and the ingot is cut off through a sawing wire along the plurality of concave pits to achieve wafer formation.