The invention discloses an electronic package assembly, which comprises a package substrate provided with a first surface and a second surface opposite to the first surface. The first surface is provided with a plurality of conductive pads. A chip is packaged onto the first surface of the package substrate. A cover plate is arranged on the chip to extend above the conductive pads. A circuit board is packaged onto the second surface of the package substrate. The circuit board is provided with an electrical connector. A plurality of electrical contact members are connected with the electrical connector and are in contact with the cover plate that extends above the conductive pads together with the conductive pads.