The invention relates to a semiconductor lead frame package and a light-emitting diode LED package. The semiconductor lead frame package comprises a chip pad, leads, a chip and an insulating body. The leads and the chip pad are electrically isolated. The chip is arranged on the chip pad and is electrically connected with the leads. The insulating body partially packages the chip pad and the leads and is provided with a top surface and a bottom surface, and a part of the leads are folded to the top surface of the insulating body.