Provided is a liquid-filled LED lamp characterized by mainly comprising a rear cover plate, a PCB lamp plate, packaging liquid, a transparent window body, and a grid body. The rear cover plate, the transparent window body, and the grid body form a sealed space from a back surface, a side surface, and a top surface. The PCB lamp plate is installed in the sealed space. A pouring orifice is processed on the surface of the grid body and is communicated with the sealed space. The packaging liquid is poured into the whole sealed space. The pouring orifice is plugged outside. According to the LED lamp filled and packaged by heat conduction liquid, a chip is arranged on a whole substrate. After direct potting of the heat conduction liquid, heat generated a light-emitting process is dissipated in multiple directions including a front surface, a side surface, and a back surface, can be conducted within shorter time so as to be effectively dissipated. The LED lamp prevents high temperature, caused by heat accumulation, from damaging the LED chip, improves the light-emitting performance of the LED chip, increases light-emitting efficiency, and has simple technology and high reliability.