The invention relates to a double-sided etching water drop salient point type package structure. The double-sided etching water drop salient point type package structure is characterized by comprising a base island (1) and a pin (2), wherein a chip (3) is positively or reversely packaged on the front side of the base island (1), a plastic package material (5) is encapsulated on a peripheral region of the base island (1), on a region between the base island (1) and the pin (2), on a region on the base island (1) and the pin (2) and outside the chip (3), and water drop salient point type pipe pins (6) are respectively arranged on the back sides of the base island (1) and the pin (2). According to a process method, the double sides of a substrate are etched to form pipe pin shapes, a package step is carried out, and finally, a water drop salient point type appearance structure is formed on the outer pipe pins by a direct etching method in no need of film lamination, so that tin paste smoothly flows to the side edge of the pipe pins during welding with a printed circuit board (PCB), the binding of the pipe pins and the PCB is enhanced, and the problem of insecure welding is prevented.