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发明授权
CN105358642B 导电性粘接膜的制造方法、导电性粘接膜、连接体的制造方法 有权

导电性粘接膜的制造方法、导电性粘接膜、连接体的制造方法
摘要：
使填充到开口部的导电性粒子可靠地转附到粘合剂树脂层。具有：向以既定图案形成在基板11的表面的多个开口部12填充溶剂13及导电性粒子3的工序；在基板11的形成开口部12的表面上，粘贴在基底膜4形成粘合剂树脂层7的粘接膜8的形成粘合剂树脂层7的面的工序；以及加热基板11，并且从基板11的表面剥离粘接膜8，将填充到开口部12内的导电性粒子3转附到粘合剂树脂层7的工序。
摘要（英）：

Electrically conductive particles filled in the openings are securely transferred and attached to the binder resin layer. The invention further includes a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.

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