利索-全球专利检索

  1. 登录
  2. 注册
发明授权
CN105374775B 焊盘、半导体器件和半导体器件的制造工艺 有权

焊盘、半导体器件和半导体器件的制造工艺
摘要：
本申请提供了一种焊盘、半导体器件和半导体器件的制造工艺。焊盘包括：金属柱，金属柱的第一端具有凹部；焊料凸块，焊料凸块设置在金属柱的凹部处；焊垫，焊垫与金属柱的第二端连接。由于金属柱的第一端具有凹部，且焊料凸块设置在金属柱的凹部处，因而有效防止焊料凸块在回流工艺时顺着金属柱的边缘流下形成介金属化合物，从而有效避免焊料凸块过多消耗和金属柱机械强度变弱，进而提高了半导体器件的封装可靠性。同时，本申请中的焊盘具有结构简单、制造成本低的特点。
摘要（英）：

The invention provides a bonding pad, a semiconductor device and a manufacturing technology of the semiconductor device. The bonding pad comprises a metal column, a solder bump and a welding pad, wherein a first end of the metal column possesses a concave portion; the solder bump is arranged at the concave portion of the metal column; and the welding pad is connected to a second end of the metal column. Because the first end of the metal column possesses the concave portion and the solder bump is arranged at the concave portion of the metal column, the solder bump is effectively prevented from flowing down along an edge of the metal column during a backflow technology to form a mesoscopic metal compound. Excessive consumption of the solder bump and weakening of mechanical strength of the metal column are effectively avoided and packaging reliability of the semiconductor device is increased. Simultaneously, the bonding pad in the invention possesses characteristics that the structure is simple and manufacturing cost is low.

公开/授权文献
0/0