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发明授权
CN105374924B 胶膜的制备装置、制备方法及倒装LED芯片的制备方法 有权

胶膜的制备装置、制备方法及倒装LED芯片的制备方法
摘要：
本发明公开了一种用于倒装LED芯片的胶膜的制备装置，包括：所述制备装置包括透光基板及设于透光基板下方的发光装置，所述透光基板的上表面设有吸光部件，所述发光装置的光线可透过透光基板照射至吸光部件上，所述吸光部件的形状与胶膜的成型图案一致。本发明还公开了一种用于倒装LED芯片的胶膜的制备方法及一种倒装LED芯片的制备方法。本发明，采用“光‑热‑固”的方式实现荧光胶固化，灵活性强，同时，在固化过程中，LED芯片不需随荧光胶一同进入烤箱进行固化，更容易实现自动化。
摘要（英）：

The invention discloses a preparation apparatus of a flip LED chip glue film. The preparation apparatus comprises a light transmission substrate and a light-emitting device arranged under the light transmission substrate. The upper surface of the light transmission substrate is provided with a light absorbing component. The light of the light-emitting device may transmit the light transmission substrate to irradiate the light absorbing component. The shape of the light absorbing component is the same as the molded pattern of the glue film. The invention also discloses a preparation method of a flip LED chip glue film and a preparation method of a flip LED chip. Fluorescent glue is solidified in a light-thermal-solid manner so that a good flexibility is achieved. Further, in a solidification process, the LED chip is not required to be solidified by entering a baking oven along with the fluorescent glue so that automation is easier to achieve.

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