Provided is a method for bubble-free splicing of plain glass through paraffin. According to the method, a vacuum chamber, a slope tool and a piezoelectric vibration plate are included, the slope tool and the piezoelectric vibration plate are arranged in the vacuum chamber, a sheet glass tool and a sheet glass workpiece to be bonded are bonded in the vacuum chamber, and therefore a bubble generating source is eliminated; the piezoelectric vibration plate is arranged below the slope tool, the sheet glass tool and the sheet glass workpiece to be bonded are arranged on the slope tool, residual bubbles escape along a slope along with ultrasonic high-frequency vibration, and therefore reducing of the residua bubbles between bonding faces and the uniformity of a bonding paraffin layer are further guaranteed. The method aims at eliminating the bubbles formed by paraffin bonding between the sheet glass workpiece and the sheet glass tool when through holes are machined in the sheet glass workpiece, and so that edge breakage is reduced when the through holes are machined.