The present invention relates to a thermosetting resin composition for a semiconductor package, a prepreg using the same, and a metal foil laminate. More specifically, the present invention provides a thermosetting resin composition for a semiconductor package, a prepreg using the same, and a metal foil laminate, the composition exhibiting a high heat resistance and reliability by using cyanate resin and benzoxizine for an epoxy-resin based thermosetting resin composition, thereby improving desmear properties, and in particular using a slurry-type filler, thereby improving chemical resistance properties.