The invention discloses a treating device for substrates of batches of silicon wafers in a sputtering technology. The device comprises a containing plate for containing the silicon wafers; multiple heating holes are formed in the bottom end face of the containing plate and communicated to a heating pipeline outside the containing plate; the heating pipeline is connected with a heating source; a filter screen extending in the horizontal direction is arranged in the containing plate; a supporting frame is arranged on the edge of the filter screen and fixedly arranged on the lateral end face of the containing plate; in the containing plate, multiple vibration motors are arranged at the bottom end of the supporting frame. By the adoption of the technical scheme, the vibration motors below the filter screen can drive the filter screen to vibrate so that the batches of silicon wafers on the filter screen can be evenly distributed, efficiency drop caused by manual arrangement of the batches of silicon wafers for evenness in the treating process is avoided, and the heating uniformity of the batches of silicon wafers in the production process can be improved.