A solar module comprises a backplane, a light transmitting substrate, a plurality of solar cells, a plurality of wires and sealing material. The solar cells are disposed between the backplane and the light transmitting substrate. Each solar cell includes a chip, a plurality of bus electrodes and a plurality of finger electrodes. Each chip includes a first chip region located in the middle and second chip regions located at two sides, and the first chip region has a greater thickness than that of the second chip regions. The bus electrodes are disposed on each chip along a first direction, and each bus electrode is disposed across the first chip region and the second chip region. The finger electrodes are disposed on each chip along a second direction. The wires are used for connecting the solar cells, and are disposed on the bus electrodes respectively and exposing at least a part of the bus electrodes on the second chip regions. The sealing material is filled between the backplane and the light transmitting substrate. The solar module and the solar cells in the invention have relatively low breakage rate.