The invention discloses a method for molding a CSP (Chip Scale Package) LED (Light-Emitting Diode) with a face-up chip, a method for molding a face-down chip and the CSP LED. The CSP LED comprises the face-up chip, wherein packaging glue is packaged on a side face and a top surface of the face-up chip; the face-up chip comprises a face-up chip body and an electrode; the electrode is provided with an extension electrode; the area of the extension electrode is larger than the area of the electrode; and a white glue layer is arranged below the face-up chip body. The method for molding the CSP LED with the face-up chip comprises the following steps: wrapping a plurality of face-up chips with the packaging glue; providing a second carrying table, and paving a second isolating membrane on the second carrying table; fixing a semi-finished product; coating the face-up chips with a photoresist, and covering a mask with the photoresist; and performing exposure, development, evaporation, cleaning, cutting and separation. The face-up chip can be taken as the face-down chip to be used, thereby bringing convenience to assembly, enhancing the electrical connection reliability, effectively preventing tin paste from climbing upwards, and preventing the phenomenon of short circuit.