The invention discloses electronic equipment. The electronic equipment comprises a first support. Heat conductivity of a first material forming the first support is larger than a first threshold value. The first support internally comprises at least one channel which has a cavity. The first support and the cavity form an enclosed space to allow a cooling medium to be able to circulate in the space. Heat conductivity of the cooling medium is larger than a second threshold value. At least one side wall of the cavity is provided with a drive film. The drive film can deform under a predetermined condition to change the capacity of the cavity, and thus the cooling medium is driven to flow.