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发明授权
CN105470365B LED晶片定位装置、定位方法，以及LED芯片制造方法 有权

LED晶片定位装置、定位方法，以及LED芯片制造方法
摘要：
本发明公开了一种LED晶片定位装置、定位方法，以及LED芯片制造方法，其中LED晶片定位装置包括：第一底板、第二底板和挤压部件；所述第一底板上设置有至少一个用于容纳衬底基片的容纳凹槽；所述第二底板上设置有与所述容纳凹槽对应的容纳孔，所述容纳孔用于容纳所述LED晶片，所述挤压部件将所述容纳孔中的LED晶片紧压到所述衬底基片上；所述第一底板和/或所述第二底板上设置有定位部件。本发明还提供了对应的定位方法和LED芯片制造方法，本发明的上述技术方案在提高LED芯片制造过程中的晶片流通效率的同时，降低了生产成本。
摘要（英）：

The invention discloses an LED chip positioning device and positioning method and an LED chip manufacturing method. The LED chip positioning device comprises a first base plate, a second base plate and an extrusion part. The first base plate is provided with at least one accommodating groove which is used for accommodating an underlying substrate. The second base plate is provided with accommodating holes which are corresponding to the accommodating grooves. The accommodating holes are used for accommodating LED chips. The extrusion part extrudes the LED chips in the accommodating holes to the underlying substrate. The first base plate and/or the second base plate are/is provided with a positioning part. The invention also provides the corresponding positioning method and the LED chip manufacturing method. According to the technical scheme, chip flow efficiency in the LED chip manufacturing process can be enhanced and production cost can be reduced.

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