The invention discloses a printed circuit board. The printed circuit board comprises a substrate layer, a circuit layer and an insulating layer that are stacked in sequence, wherein the circuit layer comprises a signal line and a power line; a grid hollow-out nick is formed in a position, facing to the position of the power line, in the insulating layer; and the grid hollow-out nick is filled with a tin material. The printed circuit board provided by the invention is provided with the power line with high current carrying capability. The invention also discloses a mobile terminal.