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发明公开
CN105500186A 晶片抛光用抛光垫及抛光垫的自吸附方法 无效 - 驳回

晶片抛光用抛光垫及抛光垫的自吸附方法
摘要：
本发明涉及一种抛光垫及吸附方法，尤其是一种晶片抛光用抛光垫及抛光垫的自吸附方法，属于化学机械抛光的技术领域。按照本发明提供的技术方案，所述晶片抛光用抛光垫，包括抛光垫体；其特征是：所述抛光垫体上设置具有吸附能力的吸附体，抛光垫体能通过吸附体与抛光大盘固定连接。本发明结构紧凑，实现抛光垫体与抛光大盘的有效连接固定，更换方便，有效减少对抛光大盘的损伤概率，提高抛光效率，适应范围广，安全可靠。
摘要（英）：

The invention relates to a polishing pad and an absorption method, in particular to a polishing pad for wafer polishing and a self-absorption method thereof, and belongs to the technical field of chemical-mechanical polishing. According to the technical scheme, the polishing pad for wafer polishing comprises a polishing pad body and is characterized in that the polishing pad body is provided with an absorption body with the absorption capacity, and the polishing pad body can be fixedly connected with a large polishing plate through the absorption body. The polishing pad is compact in structure, capable of achieving effective connection and fixation of the polishing pad body and the large polishing plate, convenient to replace, capable of effectively decreasing the probability of damage to the large polishing plate and improving the polishing efficiency, wide in application range, safe and reliable.

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