利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN105522444A 一种降低C/SiC复合材料加工磨削损伤的方法 无效 - 撤回

一种降低C/SiC复合材料加工磨削损伤的方法
摘要：
本发明涉及C/SiC复合材料加工工艺，尤其是一种降低C/SiC复合材料加工磨削损伤的方法，将C/SiC复合材料放在超声振动系统的机床上进行加工，该超声振动系统加工用的工具为杯形金刚石砂轮，金刚石磨粒目数为140/170目；金刚石砂轮末端的输出振幅不小于4μm，磨削进给速度为1-2m/min，磨削深度在10μm以下，磨削速度不大于60m/s，超声辅助磨削时杯形金刚石砂轮振动方向平行于磨削表面，砂轮表面工作层磨粒运动轨迹在C/SiC复合材料表面交错重叠，减小了单颗磨粒切厚从而降低了磨削加工损伤。
摘要（英）：

The invention relates to a C/SiC composite material machining process, in particular to a method for reducing grinding damage of a C/SiC composite material. The C/SiC composite material is put on a machine tool of an ultrasonic vibration system for machining; a tool used by the ultrasonic vibration system is a cup-shaped diamond grinding wheel; the number of diamond abrasive grains is 140/170 meshes; the output vibration amplitude of the tail end of the diamond grinding wheel is not less than 4 microns; the grinding feeding speed is 1-2 m/min; the grinding depth is below 10 microns; the grinding speed is not higher than 60 m/s; the vibration direction of the cup-shaped diamond grinding wheel is parallel to a grinded surface in ultrasonic auxiliary grinding; and motion trails of the abrasive grains on a working surface on the surface of a grinding wheel are staggered and overlapped on the surface of the C/SiC composite material, so that the cutting thickness of the single abrasive grain is reduced, and the grinding damage is reduced.

0/0