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发明公开
CN105531805A 电子器件搭载基板及其制造方法 有权

电子器件搭载基板及其制造方法
摘要：
由铜或(在表面形成镀铜皮膜20的情况下)铝、或者铝合金形成的金属板10的一侧的主面上搭载有电子器件14的电子元件搭载基板的制造方法中，实施将金属板10的一侧的主面(或镀铜皮膜20的表面)(接合电子器件14的面)粗糙化为表面粗糙度为0.4μm以上的表面加工，在其主面(或镀铜皮膜20的表面)上涂布银糊料设置电子器件14后，将银糊料中的银烧结而形成银接合层12，通过该银接合层12将电子器件14接合在金属板10的一侧的主面(或镀铜皮膜20的表面)上。
摘要（英）：

A method for producing an electronic-component-equipped substrate obtained by mounting an electronic component (14) onto one principal surface of a metal plate (10) comprising copper, or (in the case that a copper-plating film (20) is formed on the front surface thereof) aluminum or an aluminum alloy, wherein: a surface treatment causing surface roughness to be 0.4mum or higher is performed by roughening the one principal surface (or the surface having the copper-plating film (20)) (i.e. the surface to which the electronic component (14) is to be mounted) of the metal plate (10); a silver paste is applied to said principal surface (or the surface having the copper-plating film (20)), and the electronic component (14) is positioned thereon; thereafter, a silver bonding layer (12) is formed by sintering the silver in the silver paste; and the electronic component (14) is bonded to the one principal surface (or the surface having the copper-plating film (20)) of the metal plate (10) by the silver bonding layer (12).

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